Autodesk Launches Cloud-Based Alternative for Product Lifecycle Management
Updated: 2012-02-29 19:19:48
Autodesk Inc. on Feb. 29, 2012 announced the immediate availability of Autodesk PLM 360. The company states this "next-generation cloud-based alternative provides a powerful, affordable and easy-to-implement solution at a fraction of the cost of traditional product lifecycle management (PLM) systems."
Microchip Technology introduced their SST12LF03 RF front-end module for WLAN IEEE 802.11b/g/n and Bluetooth systems. The SST12LF03 includes a transmitter power amplifier, a receiver low-noise amplifier (LNA) and a low-loss antenna switch — in one integrated, compact package. The high level of integration simplifies board design and extends the range of wireless systems. It is [...]
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Macronix rolled out the MX30LF Single-Level Cell (SLC) NAND Flash family for embedded applications. The new MX30LF family is an extension of Macronix’s existing Serial and Parallel NOR Flash products. The MX30LF SLC NAND devices are sampling now. Trial production will start this quarter. Macronix is a world leading supplier of NOR Flash memory. Read [...]
Conexant Systems introduced their CX20805 digital audio processor. The CX20805 IC integrates high-speed USB 2.0, other key audio interfaces, advanced power management and a high-performance 800 MIPS digital signal processor. The new digital audio solution is based on the Conexant Audio Processing Engine (CAPE) architecture. Samples of the CX20805 DSP is available in a small [...]
VLSI Solution introduced the VS1005 all-in-one MP3 audio System-on-a-Chip. The VS1005 SoC includes controllers for high-speed USB host/slave, SD card, parallel NAND flash, SPI, Ethernet, S/PDIF, I2S master/slave and UART. The VLSI VS1005 chip is ideal for portable audio devices, docking stations, and portable recorder applications. Engineering samples of the VS1005 are expected to be [...]